Improved adhesion for difficult-to-adhere resin materials

Wet blasting pretreatment improves the plating adhesion strength of difficult-to-adhere resin materials (PI, LCP, PET, and others).
In addition, while increasing adhesion strength, it is also possible to form a "low roughness surface" with no transmission loss for electronic components.

Wet blasting creates dense submicron irregularities with particles of several microns in size, improving the adhesion of plating on these difficult-to-adhere resin materials by up to 2.5 times while maintaining surface roughness. Wet blasting pre-treatment can solve the above-mentioned problems of difficult-to-adhere resin materials in electronic components by "minimizing dielectric loss" and "improving adhesion strength".

For more details, please see below.