Wet blasting equipment for plate-shaped workpieces PFE
Wet blasting equipment for plate-shaped workpieces
Automatic equipment for plate-shaped workpieces and film mateiral and is capable of processing plate workpieces up to 600 mm wide.
This equipment is equipped with a wide gun and uniformly and simultaneously processes strip-shaped and plate workpieces of widths 600 mm or less. It is best suited for processing printed circuit boards, etc. The low-cost versions for different workpiece sizes are the mini PFE100 and 200.
Refer to the equipment catalogs "PFE" for this equipment.
- 370 mm Wide Gun x 2 or 630 mm Wide Gun x 2 - One each for top and bottom
- Fully Automatic
- Conveyor Type
Improvement of underfill wettability
By finely roughening the circuit surface of the flip chip package and improves the filling property of sealing by under fill.
Scraping of the build-up substrate
A process the filler-containing resin layer on the surface of the build-up substrate uniformly at high speed.
Substrate plating prewash
Removes surface contamination during manufacturing of printed circuit boards, to improve the adhesion of gold plating.
Flow Inside the Equipent
|2125(W) x 2125(D) x 1800(H)mm
|Width: max610 mm Length: 200-700 mm Thickness: 0.2-2.0 mm (depending on shape)
|370 mm Wide Gun x 2 or 630 mm Wide Gun x 2 - One each for top and bottom
|AC200V, 50/60 Hz, 3 phases
|Approximately 15 kW (total of all equipment and rated power)
|Air Supply Pressure
|0.5 MPa-0.7 MPa
|19.9 m3/min (NTP, at 0.25 MPa of preset blast air pressure)
|Loader, Unloader, Automatic Abrasive Supply Unit, Sludge Collection Unit, Drainage Unit