Scraping of the build-up substrate
Processing Details
- Scraping
Fine surface processing by wet blasting
Physical processing, which allows the filler-containing resin layer on the build-up substrate surface to be processed uniformly at high speed.
Process Objective
- Surface is exposed by removing a very thin layer of the surface of the substrate on which electric parts are embedded.
![filler_1](/dcms_media/image/filler_1.jpg)
- Grinding of the resin on the surface of the substrate and only the circuits are left on it.
![2.基板上の樹脂表面を、回路部分のみを残し削りこむ](/dcms_media/image/jirei_pfe_new_fig1_2.jpg)
Problems with conventional processing methods
Dry Etching (Plasma) |
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Laser |
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Machining |
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Processing Image
![filler_3](/dcms_media/image/filler_3.jpg)
The Copper Wiring's Exposure According to Wet Blasting
Features
- Half-etching of the entire surface for the filler-contained resin.
- Process selection of the resin to reduce Copper etching.
![filler_4](/dcms_media/image/filler_4.jpg)
Processing of undercoat materials
- Patterning using copper as a mask.
- High accuracy by anisotropic processing.
![filler_16](/dcms_media/image/filler_16.jpg)
- Possible to alleviate (reduce) damage to conductors by processing with resin abrasives or super fine aluminum oxide abrasives.
Processing Condition
Abrasive Used | Alumina A#2000 |
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Air Pressure | 0.25 MPa |
Processing Speed | 20 mm/sec |
Projection (Spray) Angle | 90° |
Number of Passes for Processing | 4-10 passes |
![filler_5](/dcms_media/image/filler_5.jpg)
Example of the formation of an embedded capacitor
- Patterning using copper as a mask.
- High accuracy by anisotropic processing.
![filler_16](/dcms_media/image/filler_16.jpg)