Abrasives
The selection of abrasives (projection materials, media) in wet blasting is an extremely important factor in forming the desired surface condition.
We select and provide the most suitable abrasives in terms of material, shape, particle size, hardness, and cost that meet the processing conditions required by our customers.
If you would like a detailed explanation, please feel free to contact us.
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Ceramics: Polygonal
Main Uses
Cleaning, grinding, surface roughening, etc.
Material
Alumina, etc.
Particle Size Range
3-250μm
Ceramics: Spherical
Main Uses
Beautifying, cleaning, peening, etc.
Material
Glass, Zirconia, etc.
Particle Size Range
3-250μm
Resin
Main Uses
IC deflashing, paint removal, etc.
Material
Melamine, Phenol, etc.
Particle Size Range
80-500μm
Metal
Main Uses
Descaling, etc.
Material
Rust-proof high-chromium stainless cast steel
Particle Size Range
Abrasives|Ceramics: Polygonal
Alumina and other polygonal particles have sharp protrusions and high grinding power. After processing, the surface has a narrow pitch with random uneven roughness with height differences. It is used for a wide range of applications, such as surface roughening,
Main Uses
Cleaning, grinding, surface roughening, etc.
Material
Alumina, etc.
Particle Size Range
3-250μm
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Honing of Cutting Tool Edges
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Substrate plating prewash
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Thin-film coating pretreatment
Abrasives|Ceramics: Spherical
They are spherical particles such as glass, zirconia, and alumina. By hitting or rubbing the object, the surface can be cleaned with almost no damage. Since the surface is covered with uniform dimples and has a semi-gloss finish after being processed, this process can be used for beautification as well. Another feature is the high peening effect achieved from the applied stress.
Main Uses
Beautifying, cleaning, peening, etc.
Material
Glass, Zirconia, etc.
Particle Size Range
3-250μm
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Deburring of LED pacakages
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Cleaning of critical parts for maintenance
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Peening of airplane engine parts
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Beautification of exterior parts
Abrasives|Resin
They are polygonal or spherical resin particles such as melamine and phenol resin. The main features are that the material is soft and the relative density is light. Since processing can be done with almost no damage to the workpiece, it is used for resin deburring, cleaning, and coating stripping of semiconductors as well as removal of support material from 3D-printed parts.
Main Uses
IC deflashing, paint removal, etc.
Material
Melamine, Phenol, etc.
Particle Size Range
80-500μm
Related page
Semiconductor resin deburring
Abrasives|Metal
These are special stainless steel particles with high hardness and high relative density. Compared to ceramics, they have higher toughness and are less likely to chip or crack, so they have the advantage of lower consumption and less waste. They are used for the removal of oxide scale (descaling) and deburring.
Main Uses
Descaling, etc.
Material
Rust-proof high-chromium stainless cast steel
Particle Size Range
50-300μm
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