Gratitude for attending JPCA 2024 and information on materials that were distributed there

July 24, 2024

We would like to thank the many people who visited our booth at the JPCA Show 2024, held recently at the Tokyo Big Sight East Exhibition Hall as part of the Electronic Devices 2024 Total Solutions Expo.

For those of you who we were unable to meet in person at the expo, we have made available in PDF format the materials we provided at the expo. We hope that you will take this opportunity to look at them.
If you have any questions, please feel free to contact us through this page.

Materials presented at the expo

Each language version can be viewed by clicking on the image.

English

簡体中文

日本語版

Below is a description of our exhibit's content.
In addition, a prototype of the new surface treatment method "WX", which is currently under development, was exhibited at the expo. This small device can be seen in the center left of the image shown above.
We will provide more details about the WX in a separate feature article.
But if you have any questions, please feel free to contact us through this page.

Applications and new methods introduced at the booth

The contents introduced at the expo are shown below.

Actual PCB Manufacturing Examples

PCB applications include via drilling, slitting, damage-free pre-plating cleaning, de-smearing and edge leakage removal.

Improved adhesion of dissimilar materials

Our solutions aimed at improving the adhesion strength for various electronic component-related materials, including films, copper foil, CFRP, non-ferrous metals, and glass.

Removal of altered layers from ceramic and glass

Removal of altered layers without causing any microcracks on quartz glass and ceramics.

"WX" - A new surface treatment method

"WX (Wet-X)", a new process that can handle various functional surfaces and is different from wet blasting, was introduced along with a prototype machine.

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