Cleaning of LTCC boards by wet blasting

This video demonstrates the removal of the non-conductor layer from LTCC boards by wet blasting. The vitreous non-conductive layer causes plating defects during the manufacturing of LTCC boards. We will explain why wet blasting is effective for this removal.

Furthermore, we will introduce our substrate processing equipment that is optimal for removing this non-conductor layer. We will also introduce the secondary effect of "improved plating adhesion strength" obtained by the removal of that layer.